CONFERENCES

ICICM 2025
0

2025 The 10th International Conference on Integrated Circuits and Microsystems

posted by organizer: ||81 views||Release time:Dec 20, 2024

Conference DateOct 17-Oct 19, 2025PlaceHefei, China
Submission DeadlineApr 01, 2025E-mailicicm_conf@vip.163.com
Websitehttp://icicm.net/Telephone
DESCRIPTION
★Full name: IEEE--2025 The 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025) ★Abbreviation: ICICM 2025 **Place: Hefei, China **Time: October 17-19, 2025 **Website: http://icicm.net/ ★Co-Sponsored by: ==Anhui University ==Southeast University ==University of Electronic Science and Technology of China ==Submission== 1. Full paper (publication and presentation) 2. Abstract (presentation only) ★ Electronic submission system: https://easychair.org/conferences/?conf=icicm2025 ★ Email submission: icicm_conf@vip.163.com More detail about submission, please visit at http://icicm.net/submission.html =Publication= The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc. ***ICICM2016-2024 has been successfully indexed by EI Compendex and Scopus already! ***Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing) =Topics (include but not limit)= Track 1: Electronic Design Automation (EDA) • Progress of EDA algorithms • EDA for emerging technologies • Hardware-software co-design with EDA • EDA in High Performance Computing (HPC) • EDA in analog and mixed-signal design Track 2: Integrated Circuit and System Design • Digital, analog, mixed-signal IC and SOC design technology • IC computer-aided design technology, DFM • Modeling and simulation Track 3: Semiconductor Devices and Circuits • Components and circuits for wireless systems • Low power, RF devices and circuits • Silicon/Germanium Devices and Device Physics • Compound semiconductor devices and circuits Track 4: Process Technology and Manufacturing • Silicon integrated circuits and manufacturing • Interconnect, low-K, high-K and other process technologies • Packaging and testing technology, equipment technology For more topics, please visit at: http://icicm.net/call-for-papers.html ==Organizing Committee== Advisory Chairs Junfa Mao, Shenzhen University, China Yue Hao, Xidian University, China Conference Chairs Zhigong Wang, Southeast University, China Ning Xu, Wuhan University of Technology, China Conference Co-Chairs Yu Wang,Tsinghua University,China Letian Huang, University of Electronic Science and Technology of China, China Program Chairs Jiliang Zhang, Hunan University, China Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China Sheng Chang, Wuhan University, China Yingmei Chen, Southeast University, China Xiulong Wu, Anhui University, China Zhikuang Cai, Nanjing University of Posts and Telecommunications, China Zhuo Zou, Fudan University, China Jianguo Hu, Sun Yat-sen University , China Bei Yu,The Chinese University of Hong Kong, China Program Co-Chairs Junyong Deng, Xi'an University of Posts & Telecommunications, China Jun Xu, Nanjing University, China Zhixiong Di, Southwest Jiaotong University, China Guojie Luo, Peking University, China Xiaojun Zhai, University of Essex, UK Wei Xing, The University of Sheffield, UK Program Committee Shi Pu, Wuhan University of Technology , China Haizhi Song, University Of Electronic Science And Technology Of China, China Lu Zhu, Sun Yat-sen University, China Youming Zhang, Southeast University, China Jianshi Tang, Tsinghua University, China Weiguang Sheng, Shanghai Jiao Tong University, China Hao Gao, Austria & Eindhoven University of Technology, The Netherland Yun Fang, Silicon Austria Labs, Austria Jeff Kilby, Auckland University of Technology, New Zealand Zhijun Zhou, Southeast University, China Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China Wei Hu, Northwestern Polytechnical University, China Local Chair Bowen Jia, Wuhan University of Technology , China Student Program Chairs Keping Wang, Tianjin University, China Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China Fanyi Meng, Tianjin University, China Student Program Committee Li Du, Nanjing University, China Lei Wang, Nanjing University Of Posts And Telecommunications, China Xianbo Li, Sun Yat-sen University, China Tiehu Li, Chongqing University of Technology, China Moufu Kong, University of Electronic Science and Technology of China, China Jiaxin Liu, University of Electronic Science and Technology of China, China Maliang Liu, Xidian University, China More Organizing Committee list, please visit: https://icicm.net/committee.html ==History== ICICM2016 | Chengdu on November 23-25, 2016 ICICM2017 | Nanjing on November 8-11, 2017 ICICM2018 | Shanghai on November 24-26, 2018 ICICM2019 | Beijing on October 25-27,2019 ICICM2020 | Nanjing on October 23-25, 2020 ICICM2021 | Nanjing on October 22-24, 2021 ICICM2022 | Xi'an on October 28-31, 2022 ICICM2023 | Nanjing on October 20-23, 2023 ICICM2024 | Wuhan on October 25-27, 2024 =Contact us= Ms. Mila Xiao Email: icicm_conf@vip.163.com Web: http://icicm.net/

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